Abstract: International audience; Dense integration and high operating frequencies associated with increased number of I/O buffers of FPGAs are factors contributing to electromagnetic emission (EME) increase. Consequently the radiation issue that used to be discussed at PCB level has shifted to component level. Thus it is of high interest and challenging to investigate chip electromagnetic performance. This paper presents a preliminary analysis about the impact of the placement and routing (P&R) process of logic inside the FPGA on the chip EME level. Wit...
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Topics: 
Embedded system
Computer hardware