@article{Sun_2010,<br/><span class="tab"></span> title={Analytical Model of Thermal Stress for Encapsulation and Service Process of Solar Cell Module},<br/><span class="tab"></span> volume={97–101},<br/><span class="tab"></span> ISSN={1662-8985},<br/><span class="tab"></span> url={http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.2699},<br/><span class="tab"></span> DOI={10.4028/www.scientific.net/amr.97-101.2699},<br/><span class="tab"></span> journal={Advanced Materials Research},<br/><span class="tab"></span> publisher={Trans Tech Publications,<br/><span class="tab"></span> Ltd.},<br/><span class="tab"></span> author={Sun,<br/><span class="tab"></span> Guo Hui and Yan,<br/><span class="tab"></span> Shi Lin and Chen,<br/><span class="tab"></span> Gang},<br/><span class="tab"></span> year={2010},<br/><span class="tab"></span> month=mar,<br/><span class="tab"></span> pages={2699–2702} }