@inproceedings{Mohan_2016,
title={Dynamic digital modulation thermal measurement for package fault isolation},
url={http://dx.doi.org/10.1109/ipfa.2016.7564236},
DOI={10.1109/ipfa.2016.7564236},
booktitle={2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)},
publisher={IEEE},
author={Mohan,
Aparna and Qiu,
Wen and Zee,
Bernice and Falk,
R. A. and Pham,
Tram},
year={2016},
month=jul }