Abstract: In this paper, we propose an efficient methodology for the electrothermal characterization of power amplifier (PA) integrated circuits. The proposed electrothermal analysis method predicts the effect of temperature variations on the key performances of PAs, such as gain and linearity, under realistic dynamic operating conditions. A comprehensive technique for identifying an equivalent compact thermal model, using data from 3-D finite element method thermal simulation and nonlinear curve fitting algorithms, is described. Two efficient methods fo...
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Topics: 
Optoelectronics
Electronic engineering
Electrical engineering