2016 •
Dynamic digital modulation thermal measurement for package fault isolation
Authors: Aparna Mohan, Wen Qiu, Bernice Zee, R. A. Falk, Tram Pham
Venue: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Type: Publication
Abstract: This paper describes the use of Dynamic Digital Modulation (DDM) technique for the non-destructive estimation of defect depth in flip chip and stack die packages. The thermal responses of various devices with different defect depths are analyzed using the DDM technique and the thermal rise time data extracted from the thermal signal are used to interpret the defect depth which are validated with Physical Failure Analysis (PFA).
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